Method for manufacturing touch input device and touch input device

ABSTRACT

A method for manufacturing a touch input device may be provided. The method includes: a display forming step of forming, on a single carrier substrate, a flexible display for each of a plurality of display devices, cutting the flexible display into individual pieces, and separating the flexible display from the carrier substrate; a separate structure different from electrodes used to detect touch position forming step of forming, under a single substrate, a separate structure different from electrodes used to detect touch position for each of the plurality of display devices and cutting the substrate for the separate structure into individual pieces; and an adhering step of adhering each of the individual pieces of the separated flexible display to an individual piece of the substrate for the separate structure. The substrate for the separate structure may not be relatively easily bent as compared to the flexible display.

CROSS REFERENCE TO RELATED APPLICATIONS

Priority is claimed as a continuation application to U.S. patentapplication Ser. No. 16/032,627, filed Jul. 11, 2018, which claimspriority under 35 U.S.C. § 119 to Korean Patent Application No.10-2017-0090899, filed Jul. 18, 2017, the disclosures of which areincorporated herein in its entirety.

BACKGROUND Field

The present disclosure relates to a method for manufacturing a touchinput device and the touch input device and more particularly to amethod for manufacturing a touch input device, which adheres a cutsubstrate for a pressure sensor to a cut flexible display, therebycausing the pressure sensor to be easily implemented on the flexibledisplay, and the touch input device.

Description of the Related Art

Various kinds of input devices are being used to operate a computingsystem. For example, the input device includes a button, key, joystickand touch screen. Since the touch screen is easy and simple to operate,the touch screen is increasingly being used to operate the computingsystem.

The touch screen may constitute a touch surface of a touch input deviceincluding a touch sensor panel which may be a transparent panelincluding a touch-sensitive surface. The touch sensor panel is attachedto the front side of a display screen, and then the touch-sensitivesurface may cover the visible side of the display screen. The touchscreen allows a user to operate the computing system by simply touchingthe touch screen by a finger, etc. Generally, the computing systemrecognizes the touch and a position of the touch on the touch screen andanalyzes the touch, and thus, performs operations in accordance with theanalysis.

Here, there is a demand for a touch input device capable of detectingnot only the touch position according to the touch on the touch screenbut a pressure magnitude of the touch without degrading the performanceof a display module.

Particularly, when the display panel is a flexible OLED panel, thedisplay panel is very thin and tends to be easily bent. Therefore, it isdifficult to implement a pressure sensor on the flexible OLED panelduring the manufacturing process thereof.

BRIEF SUMMARY

One embodiment is a method for manufacturing a touch input device. Themethod includes: a display forming step of forming a flexible displayfor a plurality of display devices on one carrier substrate, cutting theflexible display into individual pieces, and separating the flexibledisplay from the carrier substrate; a pressure sensor forming step offorming a pressure sensor for the plurality of display devices on onesubstrate for the pressure sensor and cutting the substrate for thepressure sensor into individual pieces; and an adhering step of adheringthe separated flexible display to the substrate for the pressure sensor,which has been cut into individual pieces.

Another embodiment is a touch input device including: a cut flexibledisplay which is cut into individual pieces for a plurality of displaydevices and is separated from a carrier substrate; a cut substrate for apressure sensor, which is cut into individual pieces for the pluralityof display devices and has the pressure sensor formed thereon; and anadhesive which adheres the separated cut flexible display to thesubstrate for the pressure sensor, which is cut into individual pieces.

Another embodiment is a method for manufacturing a touch input device.The method includes: a step of forming a flexible display for aplurality of display devices on one carrier substrate; a step ofseparating the flexible display from the carrier substrate; a step offorming a pressure sensor for the plurality of display devices on onesubstrate for the pressure sensor; a step of adhering the separatedflexible display to the substrate for the pressure sensor; and a step ofcutting the substrate for the pressure sensor and the flexible displaywhich have been adhered to each other into individual pieces.

Yet another embodiment is a method for manufacturing a touch inputdevice. The method includes: a display forming step of forming, on asingle carrier substrate, a flexible display for each of a plurality ofdisplay devices, cutting the flexible display into individual pieces,and separating the flexible display from the carrier substrate; aseparate structure different from electrodes used to detect touchposition forming step of forming, under a single substrate, a separatestructure different from electrodes used to detect touch position foreach of the plurality of display devices and cutting the substrate forthe separate structure into individual pieces; and an adhering step ofadhering each of the individual pieces of the separated flexible displayto an individual piece of the substrate for the separate structure. Thesubstrate for the separate structure may not be relatively easily bentas compared to the flexible display.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1a and 1b are schematic views of a configuration of a capacitancetype touch sensor included in a touch input device according to anembodiment of the present invention and the operation of the capacitancetype touch sensor;

FIG. 2 shows a control block for controlling a touch position, a touchpressure and a display operation in the touch input device according tothe embodiment of the present invention;

FIGS. 3a to 3b are conceptual views for describing a configuration of adisplay module in the touch input device according to the embodiment ofthe present invention;

FIGS. 4a to 4e show an example in which a pressure sensor is formed inthe in the touch input device according to the embodiment of the presentinvention;

FIGS. 5a to 5c are cross sectional views showing an embodiment of thepressure sensor formed directly on various display panel of the touchinput device according to the embodiment of the present invention;

FIGS. 6a to 6f are cross sectional views of the touch input device,which shows the arrangement relationship between the pressure sensor anda light shielding layer according to the embodiment of the presentinvention;

FIG. 7 is a cross sectional view showing the structure of a flexibledisplay according to the embodiment of the present invention;

FIGS. 8a and 8b are views showing a schematized process for forming theflexible display according to FIG. 7;

FIGS. 9a to 9d show the forms of an electrode included in the touchinput device according to the embodiment of the present invention;

FIG. 10 is a view showing that the pressure sensor according to theembodiment of the present invention is a strain gauge; and

FIGS. 11 to 17 are views for describing various methods for forming thepressure sensor on a third substrate layer according to the embodimentof the present invention.

DETAILED DESCRIPTION

The following detailed description of the present invention shows aspecified embodiment of the present invention and will be provided withreference to the accompanying drawings. The embodiment will be describedin enough detail that those skilled in the art are able to embody thepresent invention. It should be understood that various embodiments ofthe present invention are different from each other and need not bemutually exclusive. For example, a specific shape, structure andproperties, which are described in this disclosure, may be implementedin other embodiments without departing from the spirit and scope of thepresent invention with respect to one embodiment. Also, it should benoted that positions or placements of individual components within eachdisclosed embodiment may be changed without departing from the spiritand scope of the present invention. Therefore, the following detaileddescription is not intended to be limited. If adequately described, thescope of the present invention is limited only by the appended claims ofthe present invention as well as all equivalents thereto. Similarreference numerals in the drawings designate the same or similarfunctions in many aspects.

Hereinafter, a touch input device according to an embodiment of thepresent invention will be described with reference to the accompanyingdrawings. Hereinafter, while a capacitive touch sensor panel and apressure detection module are exemplified below, it is possible to applya touch sensor panel and a pressure detection module which are capableof detecting a touch position and/or a touch pressure in any manner.

FIG. 1a is schematic views of a configuration of the capacitance typetouch sensor 10 included in the touch input device according to theembodiment of the present invention and the operation of the capacitancetype touch sensor. Referring to FIG. 1a , the touch sensor 10 mayinclude a plurality of drive electrodes TX1 to TXn and a plurality ofreceiving electrodes RX1 to RXm, and may include a drive unit 12 whichapplies a drive signal to the plurality of the drive electrodes TX1 toTXn for the purpose of the operation of the touch sensor 10, and asensing unit 11 which detects the touch and the touch position byreceiving from the plurality of the receiving electrodes RX1 to RXm asensing signal including information on a capacitance change amountchanging according to the touch on a touch surface.

As shown in FIG. 1a , the touch sensor 10 may include the plurality ofdrive electrodes TX1 to TXn and the plurality of receiving electrodesRX1 to RXm. While FIG. 1a shows that the plurality of drive electrodesTX1 to TXn and the plurality of receiving electrodes RX1 to RXm of thetouch sensor 10 form an orthogonal array, the present invention is notlimited to this. The plurality of drive electrodes TX1 to TXn and theplurality of receiving electrodes RX1 to RXm has an array of arbitrarydimension, for example, a diagonal array, a concentric array, a3-dimensional random array, etc., and an array obtained by theapplication of them. Here, “n” and “m” are positive integers and may bethe same as each other or may have different values. The magnitude ofthe value may be changed depending on the embodiment.

The plurality of drive electrodes TX1 to TXn and the plurality ofreceiving electrodes RX1 to RXm may be arranged to cross each other. Thedrive electrode TX may include the plurality of drive electrodes TX1 toTXn extending in a first axial direction. The receiving electrode RX mayinclude the plurality of receiving electrodes RX1 to RXm extending in asecond axial direction crossing the first axial direction.

As shown in FIGS. 9a and 9b , in the touch sensor 10 according to theembodiment of the present invention, the plurality of drive electrodesTX1 to TXn and the plurality of receiving electrodes RX1 to RXm may beformed in the same layer. For example, the plurality of drive electrodesTX1 to TXn and the plurality of receiving electrodes RX1 to RXm may beformed on a top surface of a display panel 200A to be described later.

Also, as shown in FIG. 16c , the plurality of drive electrodes TX1 toTXn and the plurality of receiving electrodes RX1 to RXm may be formedin different layers. For example, any one of the plurality of driveelectrodes TX1 to TXn and the plurality of receiving electrodes RX1 toRXm may be formed on the top surface of the display panel 200A, and theother may be formed on a bottom surface of a cover to be described lateror may be formed within the display panel 200A.

The plurality of drive electrodes TX1 to TXn and the plurality ofreceiving electrodes RX1 to RXm may be made of a transparent conductivematerial (for example, indium tin oxide (ITO) or antimony tin oxide(ATO) which is made of tin oxide (SnO₂), and indium oxide (In₂O₃),etc.), or the like. However, this is only an example. The driveelectrode TX and the receiving electrode RX may be also made of anothertransparent conductive material or an opaque conductive material. Forinstance, the drive electrode TX and the receiving electrode RX mayinclude at least any one of silver ink, copper, and carbon nanotube(CNT). Also, the drive electrode TX and the receiving electrode RX maybe made of metal mesh.

The drive unit 12 according to the embodiment of the present inventionmay apply a drive signal to the drive electrodes TX1 to TXn. In theembodiment of the present invention, one drive signal may besequentially applied at a time to the first drive electrode TX1 to then-th drive electrode TXn. The drive signal may be applied againrepeatedly. This is only an example. The drive signal may be applied tothe plurality of drive electrodes at the same time in accordance withthe embodiment.

Through the receiving electrodes RX1 to RXm, the sensing unit 11receives the sensing signal including information on a capacitance (Cm)14 generated between the receiving electrodes RX1 to RXm and the driveelectrodes TX1 to TXn to which the driving signal has been applied,thereby detecting whether or not the touch has occurred and where thetouch has occurred. For example, the sensing signal may be a signalcoupled by the capacitance (Cm) 14 generated between the receivingelectrode RX and the drive electrode TX to which the driving signal hasbeen applied. As such, the process of sensing the driving signal appliedfrom the first drive electrode TX1 to the n-th drive electrode TXnthrough the receiving electrodes RX1 to RXm can be referred to as aprocess of scanning the touch sensor 10.

For example, the sensing unit 11 may include a receiver (not shown)which is connected to each of the receiving electrodes RX1 to RXmthrough a switch. The switch becomes the on-state in a time intervalduring which the signal of the corresponding receiving electrode RX issensed, thereby allowing the receiver to sense the sensing signal fromthe receiving electrode RX. The receiver may include an amplifier (notshown) and a feedback capacitor coupled between the negative (−) inputterminal of the amplifier and the output terminal of the amplifier,i.e., coupled to a feedback path. Here, the positive (+) input terminalof the amplifier may be connected to the ground. Also, the receiver mayfurther include a reset switch which is connected in parallel with thefeedback capacitor. The reset switch may reset the conversion fromcurrent to voltage that is performed by the receiver. The negative inputterminal of the amplifier is connected to the corresponding receivingelectrode RX and receives and integrates a current signal includinginformation on the capacitance (Cm) 14, and then converts the integratedcurrent signal into voltage. The sensing unit 11 may further include ananalog to digital converter (ADC) (not shown) which converts theintegrated data by the receiver into digital data. Later, the digitaldata may be input to a processor (not shown) and processed to obtaininformation on the touch on the touch sensor 10. The sensing unit 11 mayinclude the ADC and processor as well as the receiver.

A controller 13 may perform a function of controlling the operations ofthe drive unit 12 and the sensing unit 11. For example, the controller13 generates and transmits a drive control signal to the drive unit 12,so that the driving signal can be applied to a predetermined driveelectrode TX1 at a predetermined time. Also, the controller 13 generatesand transmits the drive control signal to the sensing unit 11, so thatthe sensing unit 11 may receive the sensing signal from thepredetermined receiving electrode RX at a predetermined time and performa predetermined function.

In FIG. 1a , the drive unit 12 and the sensing unit 11 may constitute atouch detection device (not shown) capable of detecting whether thetouch has occurred on the touch sensor 10 or not and where the touch hasoccurred. The touch detection device may further include the controller13. In the touch input device including the touch sensor 10, the touchdetection device may be integrated and implemented on a touch sensingintegrated circuit (IC) corresponding to a below-described touch sensorcontroller 1100. The drive electrode TX and the receiving electrode RXincluded in the touch sensor 10 may be connected to the drive unit 12and the sensing unit 11 included in the touch sensing IC through, forexample, a conductive trace and/or a conductive pattern printed on acircuit board, or the like. The touch sensing IC may be placed on acircuit board on which the conductive pattern has been printed, forexample, a touch circuit board (hereafter, referred to as a touch PCB)in FIGS. 6a to 6f . According to the embodiment, the touch sensing ICmay be mounted on a main board for operation of the touch input device.

As described above, a capacitance (Cm) with a predetermined value isgenerated at each crossing of the drive electrode TX and the receivingelectrode RX. When an object like a finger approaches close to the touchsensor 10, the value of the capacitance may be changed. In FIG. 1a , thecapacitance may represent a mutual capacitance (Cm). The sensing unit 11senses such electrical characteristics, thereby being able to sensewhether the touch has occurred on the touch sensor 10 or not and wherethe touch has occurred. For example, the sensing unit 11 is able tosense whether the touch has occurred on the surface of the touch sensor10 comprised of a two-dimensional plane consisting of a first axis and asecond axis.

More specifically, when the touch occurs on the touch sensor 10, thedrive electrode TX to which the driving signal has been applied isdetected, so that the position of the second axial direction of thetouch can be detected. Likewise, when the touch occurs on the touchsensor 10, the capacitance change is detected from the reception signalreceived through the receiving electrode RX, so that the position of thefirst axial direction of the touch can be detected.

Up to now, although the operation mode of the touch sensor 10 sensingthe touch position has been described on the basis of the mutualcapacitance change amount between the drive electrode TX and thereceiving electrode RX, the embodiment of the present invention is notlimited to this. That is, as shown in FIG. 1b , it is also possible todetect the touch position on the basis of the change amount of aself-capacitance.

FIG. 1b is schematic views of a configuration of another capacitancetype touch sensor 10 included in the touch input device according toanother embodiment of the present invention and the operation of thecapacitance type touch sensor. A plurality of touch electrodes 30 areprovided on the touch sensor 10 shown in FIG. 1b . Although theplurality of touch electrodes 30 may be, as shown in FIG. 9d , disposedat a regular interval in the form of a grid, the present invention isnot limited to this.

The drive control signal generated by the controller 13 is transmittedto the drive unit 12. On the basis of the drive control signal, thedrive unit 12 applies the drive signal to the predetermined touchelectrode 30 for a predetermined time period. Also, the drive controlsignal generated by the controller 13 is transmitted to the sensing unit11. On the basis of the drive control signal, the sensing unit 11receives the sensing signal from the predetermined touch electrode 30for a predetermined time period. Here, the sensing signal may be asignal for the change amount of the self-capacitance formed on the touchelectrode 30.

Here, whether the touch has occurred on the touch sensor 10 or notand/or the touch position are detected by the sensing signal detected bythe sensing unit 11. For example, since the coordinate of the touchelectrode 30 has been known in advance, whether the touch of the objecton the surface of the touch sensor 10 has occurred or not and/or thetouch position can be detected.

In the foregoing, for convenience of description, it has been describedthat the drive unit 12 and the sensing unit 11 operate individually as aseparate block. However, the operation to apply the drive signal to thetouch electrode 30 and to receive the sensing signal from the touchelectrode 30 can be also performed by one drive and sensing unit.

The foregoing has described in detail the capacitance type touch sensoras the touch sensor 10. However, in the touch input device 1000according to the embodiment of the present invention, the touch sensor10 for detecting whether or not the touch has occurred and the touchposition may be implemented by using not only the above-described methodbut also any touch sensing method such as a surface capacitance typemethod, a projected capacitance type method, a resistance film method, asurface acoustic wave (SAW) method, an infrared method, an opticalimaging method, a dispersive signal technology, and an acoustic pulserecognition method, etc.

FIG. 2 shows a control block for controlling the touch position, a touchpressure and a display operation in the touch input device according tothe embodiment of the present invention. In the touch input device 1000configured to detect the touch pressure in addition to the displayfunction and touch position detection, the control block may include theabove-described touch sensor controller 1100 for detecting the touchposition, a display controller 1200 for driving the display panel, and apressure sensor controller 1300 for detecting the pressure. The displaycontroller 1200 may include a control circuit which receives an inputfrom an application processor (AP) or a central processing unit (CPU) ona main board for the operation of the touch input device 1000 anddisplays the contents that the user wants on the display panel 200A. Thecontrol circuit may be mounted on a display circuit board (hereafter,referred to as a display PCB). The control circuit may include a displaypanel control IC, a graphic controller IC, and a circuit required tooperate other display panel 200A.

The pressure sensor controller 1300 for detecting the pressure through apressure sensing unit may be configured similarly to the touch sensorcontroller 1100, and thus, may operate similarly to the touch sensorcontroller 1100. Specifically, as shown in FIGS. 1a and 1b , thepressure sensor controller 1300 may include the drive unit, the sensingunit, and the controller, and may detect a magnitude of the pressure bythe sensing signal sensed by the sensing unit. Here, the pressure sensorcontroller 1300 may be mounted on the touch PCB on which the touchsensor controller 1100 has been mounted or may be mounted on the displayPCB on which the display controller 1200 has been mounted.

According to the embodiment, the touch sensor controller 1100, thedisplay controller 1200, and the pressure sensor controller 1300 may beincluded as different components in the touch input device 1000. Forexample, the touch sensor controller 1100, the display controller 1200,and the pressure sensor controller 1300 may be composed of differentchips respectively. Here, a processor 1500 of the touch input device1000 may function as a host processor for the touch sensor controller1100, the display controller 1200, and the pressure sensor controller1300.

The touch input device 1000 according to the embodiment of the presentinvention may include an electronic device including a display screenand/or a touch screen, such as a cell phone, a personal data assistant(PDA), a smartphone, a tablet personal computer (PC).

In order to manufacture such a thin and lightweight light-weighing touchinput device 1000, the touch sensor controller 1100, the displaycontroller 1200, and the pressure sensor controller 1300, which are, asdescribed above, formed separately from each other, may be integratedinto one or more configurations in accordance with the embodiment of thepresent invention. In addition to this, these controllers can beintegrated into the processor 1500 respectively. Also, according to theembodiment of the present invention, the touch sensor 10 and/or thepressure sensing unit may be integrated into the display panel 200A.

In the touch input device 1000 according to the embodiment of thepresent invention, the touch sensor 10 for detecting the touch positionmay be positioned outside or inside the display panel 200A. The displaypanel 200A of the touch input device 1000 according to the embodiment ofthe present invention may be a display panel included in a liquidcrystal display (LCD), a plasma display panel (PDP), an organic lightemitting diode (OLED), etc. Accordingly, a user may perform the inputoperation by touching the touch surface while visually identifying animage displayed on the display panel.

FIGS. 3a and 3b are conceptual views for describing a configuration of adisplay module 200 in the touch input device 1000 according to theembodiment of the present invention. First, the configuration of thedisplay module 200 including the display panel 200A using an LCD panelwill be described with reference to FIG. 3 a.

As shown in FIG. 3a , the display module 200 may include the displaypanel 200A that is an LCD panel, a first polarization layer 271 disposedon the display panel 200A, and a second polarization layer 272 disposedunder the display panel 200A. The display panel 200A that is an LCDpanel may include a liquid crystal layer 250 including a liquid crystalcell, a first substrate layer 261 disposed on the liquid crystal layer250, and a second substrate layer 262 disposed under the liquid crystallayer 250. Here, the first substrate layer 261 may be made of colorfilter glass, and the second substrate layer 262 may be made of TFTglass. Also, according to the embodiment, at least one of the firstsubstrate layer 261 and the second substrate layer 262 may be made of abendable material such as plastic. In FIG. 3a , the second substratelayer 262 may be comprised of various layers including a data line, agate line, TFT, a common electrode, and a pixel electrode, etc. Theseelectrical components may operate in such a manner as to generate acontrolled electric field and orient liquid crystals located in theliquid crystal layer 250.

Next, the configuration of the display module 200 including the displaypanel 200A using an OLED panel will be described with reference to FIG.3 b.

As shown in FIG. 3b , the display module 200 may include the displaypanel 200A that is an OLED panel, and a first polarization layer 282disposed on the display panel 200A. The display panel 200A that is anOLED panel may include an organic material layer 280 including anorganic light-emitting diode (OLED), a first substrate layer 281disposed on the organic material layer 280, and a second substrate layer283 disposed under the organic material layer 280. Here, the firstsubstrate layer 281 may be made of encapsulation glass, and the secondsubstrate layer 283 may be made of TFT glass. Also, according to theembodiment, at least one of the first substrate layer 281 and the secondsubstrate layer 283 may be made of a bendable material such as plastic.The OLED panel shown in FIG. 3b may include an electrode used to drivethe display panel 200A, such as a gate line, a data line, a first powerline (ELVDD), a second power line (ELVSS), etc. The organiclight-emitting diode (OLED) panel is a self-light emitting display panelwhich uses a principle where, when current flows through a fluorescentor phosphorescent organic thin film and then electrons and electronholes are combined in the organic material layer, so that light isgenerated. The organic material constituting the light emitting layerdetermines the color of the light.

Specifically, the OLED uses a principle in which when an organicmaterial is disposed on glass or plastic and electricity flows, and thenthe organic material emits light. That is, the principle is thatelectron holes and electrons are injected into the anode and cathode ofthe organic material respectively and are recombined in the lightemitting layer, so that a high energy exciton is generated and theexciton releases the energy while falling down to a low energy state andthen light with a particular wavelength is generated. Here, the color ofthe light is changed according to the organic material of the lightemitting layer.

The OLED includes a line-driven passive-matrix organic light-emittingdiode (PM-OLED) and an individual driven active-matrix organiclight-emitting diode (AM-OLED) in accordance with the operatingcharacteristics of a pixel constituting a pixel matrix. None of themrequire a backlight. Therefore, the OLED enables a very thin displaymodule to be implemented, has a constant contrast ratio according to anangle and obtains a good color reproductivity depending on atemperature. Also, it is very economical in that non-driven pixel doesnot consume power.

In terms of operation, the PM-OLED emits light only during a scanningtime at a high current, and the AM-OLED maintains a light emitting stateonly during a frame time at a low current. Therefore, the AM-OLED has aresolution higher than that of the PM-OLED and is advantageous fordriving a large area display panel and consumes low power. Also, a thinfilm transistor (TFT) is embedded in the AM-OLED, and thus, eachcomponent can be individually controlled, so that it is easy toimplement a delicate screen.

Also, the organic material layer 280 may include a hole injection layer(HIL), a hole transport layer (HTL), an electron injection layer (EIL),an electron transport layer (ETL), and an emission material layer (EML).

Briefly describing each of the layers, HIL injects electron holes and ismade of a material such as CuPc, etc. HTL functions to move the injectedelectron holes and mainly is made of a material having a good holemobility. Arylamine, TPD, and the like may be used as the HTL. The EILand ETL inject and transport electrons. The injected electrons andelectron holes are combined in the EML and emit light. The EMLrepresents the color of the emitted light and is composed of a hostdetermining the lifespan of the organic material and an impurity(dopant) determining the color sense and efficiency. This just describesthe basic structure of the organic material layer 280 include in theOLED panel. The present invention is not limited to the layer structureor material, etc., of the organic material layer 280.

The organic material layer 280 is inserted between an anode (not shown)and a cathode (not shown). When the TFT becomes an on-state, a drivingcurrent is applied to the anode and the electron holes are injected, andthe electrons are injected to the cathode. Then, the electron holes andelectrons move to the organic material layer 280 and emit the light.

It will be apparent to a skilled person in the art that the LCD panel orthe OLED panel may further include other structures so as to perform thedisplay function and may be transformed.

The display module 200 of the touch input device 1000 according to theembodiment of the present invention may include the display panel 200Aand a configuration for driving the display panel 200A. Specifically,when the display panel 200A is an LCD panel, the display module 200 mayinclude a backlight unit (not shown) disposed under the secondpolarization layer 272 and may further include a display panel controlIC for operation of the LCD panel, a graphic control IC, and othercircuits.

In the touch input device 1000 according to the embodiment of thepresent invention, the touch sensor 10 for detecting the touch positionmay be positioned outside or inside the display module 200.

When the touch sensor 10 in the touch input device 1000 positionedoutside the display module 200, the touch sensor panel may be disposedon the display module 200, and the touch sensor 10 may be included inthe touch sensor panel. The touch surface of the touch input device 1000may be the surface of the touch sensor panel.

When the touch sensor 10 in the touch input device 1000 positionedinside the display module 200, the touch sensor 10 may be configured tobe positioned outside the display panel 200A. Specifically, the touchsensor 10 may be formed on the top surfaces of the first substratelayers 261 and 281. Here, the touch surface of the touch input device1000 may be an outer surface of the display module 200 and may be thetop surface or bottom surface in FIGS. 3 and 3 b.

When the touch sensor 10 in the touch input device 1000 positionedinside the display module 200, at least a portion of the touch sensor 10may be configured to be positioned inside the display panel 200A, and atleast a portion of the remaining touch sensor 10 may be configured to bepositioned outside the display panel 200A. For example, any one of thedrive electrode TX and the receiving electrode RX, which constitute thetouch sensor 10, may be configured to be positioned outside the displaypanel 200A, and the other may be configured to be positioned inside thedisplay panel 200A. Specifically, any one of the drive electrode TX andthe receiving electrode RX, which constitute the touch sensor 10, may beformed on the top surface of the top surfaces of the first substratelayers 261 and 281, and the other may be formed on the bottom surfacesof the first substrate layers 261 and 281 or may be formed on the topsurfaces of the second substrate layers 262 and 283.

When the touch sensor 10 in the touch input device 1000 positionedinside the display module 200, the touch sensor 10 may be configured tobe positioned inside the display panel 200A. Specifically, the touchsensor 10 may be formed on the bottom surfaces of the first substratelayers 261 and 281 or may be formed on the top surfaces of the secondsubstrate layers 262 and 283.

When the touch sensor 10 is positioned inside the display panel 200A, anelectrode for operation of the touch sensor may be additionallydisposed. However, various configurations and/or electrodes positionedinside the display panel 200A may be used as the touch sensor 10 forsensing the touch. Specifically, when the display panel 200A is the LCDpanel, at least any one of the electrodes included in the touch sensor10 may include at least any one of a data line, a gate line, TFT, acommon electrode (Vcom), and a pixel electrode. When the display panel200A is the OLED panel, at least any one of the electrodes included inthe touch sensor 10 may include at least any one of a data line, a gateline, a first power line (ELVDD), and a second power line (ELVSS).

Here, the touch sensor 10 may function as the drive electrode and thereceiving electrode described in FIG. 1a and may detect the touchposition in accordance with the mutual capacitance between the driveelectrode and the receiving electrode. Also, the touch sensor 10 mayfunction as the single electrode 30 described in FIG. 1b and may detectthe touch position in accordance with the self-capacitance of each ofthe single electrodes 30. Here, if the electrode included in the touchsensor 10 is used to drive the display panel 200A, the touch sensor 10may drive the display panel 200A in a first time interval and may detectthe touch position in a second time interval different from the firsttime interval.

Hereafter, in order to detect the touch pressure in the touch inputdevice according to the embodiment of the present invention, thefollowing detailed description will be provided by taking an example ofa case where a separate sensor which is different from the electrodeused to detect the touch position and the electrode used to drive thedisplay is disposed and used as the pressure sensing unit.

In the touch input device 1000 according to the embodiment of thepresent invention, by means of an adhesive like an optically clearadhesive (OCA), lamination may occur between a cover layer 100 on whichthe touch sensor for detecting the touch position has been formed andthe display module 200 including the display panel 200A. As a result,the display color clarity, visibility and optical transmittance of thedisplay module 200, which can be recognized through the touch surface ofthe touch sensor, can be improved.

FIGS. 4a to 4e show an example in which the pressure sensor is formed inthe in the touch input device according to the embodiment of the presentinvention.

In FIG. 4a and some of the following figures, it is shown that thedisplay panel 200A is directly laminated on and attached to the coverlayer 100. However, this is only for convenience of description. Thedisplay module 200 where the first polarization layers 271 and 282 islocated on the display panel 200A may be laminated on and attached tothe cover layer 100. When the LCD panel is the display panel 200A, thesecond polarization layer 272 and the backlight unit are omitted.

In the description with reference to FIGS. 4a to 4e , it is shown thatas the touch input device 1000 according to the embodiment of thepresent invention, the cover layer 100 in which the touch sensor hasbeen formed is laminated on and attached to the display module 200 shownin FIGS. 3a and 3b by means of an adhesive. However, the touch inputdevice 1000 according to the embodiment of the present invention mayinclude that the touch sensor 10 is disposed inside the display module200 shown in FIGS. 3a and 3b . More specifically, while FIGS. 4a to 4bshow that the cover layer 100 where the touch sensor 10 has been formedcovers the display module 200 including the display panel 200A, thetouch input device 1000 which includes the touch sensor 10 disposedinside the display module 200 and includes the display module 200covered with the cover layer 100 like glass may be used as theembodiment of the present invention.

The touch input device 1000 according to the embodiment of the presentinvention may include an electronic device including the touch screen,for example, a cell phone, a personal data assistant (PDA), a smartphone, a tablet personal computer, an MP3 player, a laptop computer,etc.

In the touch input device 1000 according to the embodiment of thepresent invention, a substrate 300, together with an outermost housing320 of the touch input device 1000, may function to surround a mountingspace 310, etc., where the circuit board and/or battery for operation ofthe touch input device 1000 are placed. Here, the circuit board foroperation of the touch input device 1000 may be a main board. A centralprocessing unit (CPU), an application processor (AP) or the like may bemounted on the circuit board. Due to the substrate 300, the displaymodule 200 is separated from the circuit board and/or battery foroperation of the touch input device 1000. Due to the substrate 300,electrical noise generated from the display module 200 and noisegenerated from the circuit board can be blocked.

The touch sensor 10 or the cover layer 100 of the touch input device1000 may be formed wider than the display module 200, the substrate 300,and the mounting space 310. As a result, the housing 320 may be formedsuch that the housing 320, together with the touch sensor 10, surroundsthe display module 200, the substrate 300, and the circuit board.

The touch input device 1000 according to the embodiment of the presentinvention may detect the touch position through the touch sensor 10 andmay detect the touch pressure by disposing a separate sensor which isdifferent from the electrode used to detect the touch position and theelectrode used to drive the display and by using the separate sensor asthe pressure sensing unit. Here, the touch sensor 10 may be disposedinside or outside the display module 200.

Hereinafter, the components for detecting the pressure are collectivelyreferred to as the pressure sensing unit. For example, the pressuresensing unit may include pressure sensors 450 and 460.

Also, the pressure sensing unit may be formed to further include, forexample, a spacer layer 420 composed of an air gap. This will bedescribed in detail with reference to FIGS. 4a to 4 d.

According to the embodiment, the spacer layer 420 may be implemented bythe air gap. According to the embodiment, the spacer layer 420 may bemade of an impact absorbing material. According to the embodiment, thespacer layer 420 may be filled with a dielectric material. According tothe embodiment, the spacer layer 420 may be made of a material having arestoring force by which the material contracts by applying the pressureand returns to its original shape by releasing the pressure. Accordingto the embodiment, the spacer layer 420 may be made of elastic foam.Also, since the spacer layer is disposed under the display module 200,the spacer layer may be made of a transparent material or an opaquematerial.

Also, a reference potential layer may be disposed under the displaymodule 200. Specifically, the reference potential layer may be formed onthe substrate 300 disposed under the display module 200. Alternatively,the substrate 300 itself may serve as the reference potential layer.Also, the reference potential layer may be disposed on the cover (notshown) which is disposed on the substrate 300 and under the displaymodule 200 and functions to protect the display module 200.Alternatively, the cover itself may serve as the reference potentiallayer. When a pressure is applied to the touch input device 1000, thedisplay panel 200A is bent. Due to the bending of the display panel200A, a distance between the reference potential layer and the pressuresensor 450 and 460 may be changed. Also, the spacer layer may bedisposed between the reference potential layer and the pressure sensor450 and 460. Specifically, the spacer layer may be disposed between thedisplay module 200 and the substrate 300 where the reference potentiallayer has been disposed or between the display module 200 and the coverwhere the reference potential layer has been disposed.

Also, the reference potential layer may be disposed inside the displaymodule 200. Specifically, the reference potential layer may be disposedon the top surfaces or bottom surfaces of the first substrate layers 261and 281 of the display panel 200A or on the top surfaces or bottomsurfaces of the second substrate layers 262 and 283. When a pressure isapplied to the touch input device 1000, the display panel 200A is bent.Due to the bending of the display panel 200A, the distance between thereference potential layer and the pressure sensor 450 and 460 may bechanged. Also, the spacer layer may be disposed between the referencepotential layer and the pressure sensor 450 and 460. In the case of thetouch input device 1000 shown in FIGS. 3a and 3b , the spacer layer maybe disposed on or inside the display panel 200A.

Likewise, according to the embodiment, the spacer layer may beimplemented by the air gap. According to the embodiment, the spacerlayer may be made of an impact absorbing material. According to theembodiment, the spacer layer may be filled with a dielectric material.According to the embodiment, the spacer layer may be made of an elasticfoam. Here, the elastic foam according to the embodiment has aflexibility that changes the shape thereof, for example, allows theelastic foam to be pressed when an impact is applied to the elasticfoam, so that the elastic foam may not only serve to absorb the impactbut also have the restoring force to provide the performance uniformityfor the pressure detection. Also, since the spacer layer is disposed onor inside the display panel 200A, the spacer layer may be made of atransparent material. Here, the elastic foam according to the embodimentmay include at least any one of polyurethane, polyester, polypropylene,and acrylic.

According to the embodiment, when the spacer layer is disposed insidethe display module 200, the spacer layer may be the air gap which isincluded during the manufacture of the display panel 200A and/or thebacklight unit. When the display panel 200A and/or the backlight unitincludes one air gap, the one air gap may function as the spacer layer.When the display panel 200A and/or the backlight unit includes aplurality of the air gaps, the plurality of air gaps may collectivelyfunction as the spacer layer.

Hereafter, for the purpose of clearly distinguishing the electrodes 450and 460 from the electrode included in the touch sensor 10, the sensors450 and 460 for detecting the pressure are designated as pressuresensors 450 and 460. Here, since the pressure sensors 450 and 460 aredisposed in the back side instead of in the front side of the displaypanel 200A, the pressure sensor 450 and 460 may be made of an opaquematerial as well as a transparent material. When the display panel 200Ais the LCD panel, the light from the backlight unit must transmitthrough the pressure sensors 450 and 460. Therefore, the pressuresensors 450 and 460 may be made of a transparent material such as ITO.

Here, a frame 330 having a predetermined height may be formed along theborder of the upper portion of the substrate 300 in order to maintainthe spacer layer 420 in which the pressure sensor 450 and 460 aredisposed. Here, the frame 330 may be bonded to the cover layer 100 bymeans of an adhesive tape (not shown). While FIG. 4b shows the frame 330is formed on the entire border (e.g., four sides of the quadrangle) ofthe substrate 300, the frame 330 may be formed only on at least some(e.g., three sides of the quadrangle) of the border of the substrate300. According to the embodiment, the frame 330 may be formed on the topsurface of the substrate 300 may be integrally formed with the substrate300 on the top surface of the substrate 300. In the embodiment of thepresent invention, the frame 330 may be made of an inelastic material.In the embodiment of the present invention, when a pressure is appliedto the display panel 200A through the cover layer 100, the display panel200A, together with the cover layer 100, may be bent. Therefore, themagnitude of the touch pressure can be detected even though the frame330 is not transformed by the pressure.

FIG. 4c is a cross sectional view of the touch input device includingthe pressure sensor according to the embodiment of the presentinvention. As shown in FIG. 4c , the pressure sensors 450 and 460according to the embodiment of the present invention may be formedwithin the spacer layer 420 and on the bottom surface of the displaypanel 200A.

The pressure sensor for detecting the pressure may include the firstsensor 450 and the second sensor 460. Here, any one of the first sensor450 and the second sensor 460 may be a drive sensor, and the other maybe a receiving sensor. A drive signal is applied to the drive sensor,and a sensing signal including information on electrical characteristicschanging by applying the pressure may be obtained through the receivingsensor. For example, when a voltage is applied, a mutual capacitance maybe generated between the first sensor 450 and the second sensor 460.

FIG. 4d is a cross sectional view when a pressure is applied to thetouch input device 1000 shown in FIG. 4c . The top surface of thesubstrate 300 may have a ground potential for shielding the noise. Whena pressure is applied to the surface of the cover layer 100 by an object500, the cover layer 100 and the display panel 200A may be bent orpressed. As a result, a distance “d” between the ground potentialsurface and the pressure sensors 450 and 460 may be decreased to “d′”.In this case, due to the decrease of the distance “d”, the fringingcapacitance is absorbed in the top surface of the substrate 300, so thatthe mutual capacitance between the first sensor 450 and the secondsensor 460 may be reduced. Therefore, the magnitude of the touchpressure can be calculated by obtaining the reduction amount of themutual capacitance from the sensing signal obtained through thereceiving sensor.

Although it has been described in FIG. 4d that the top surface of thesubstrate 300 has the ground potential, that is to say, is the referencepotential layer, the reference potential layer may be disposed insidethe display module 200. Here, when a pressure is applied to the surfaceof the cover layer 100 by the object 500, the cover layer 100 and thedisplay panel 200A may be bent or pressed. As a result, a distancebetween the pressure sensors 450 and 460 and the reference potentiallayer disposed inside the display module 200 is changed. Therefore, themagnitude of the touch pressure can be calculated by obtaining thecapacitance change amount from the sensing signal obtained through thereceiving sensor.

In the touch input device 1000 according to the embodiment of thepresent invention, the display panel 200A may be bent or pressed by thetouch applying the pressure. When the display panel 200A is bent orpressed according to the embodiment, a position showing the biggesttransformation may not match the touch position. However, the displaypanel 200A may be shown to be bent at least at the touch position. Forexample, when the touch position approaches close to the border, edge,etc., of the display panel 200A, the most bent or pressed position ofthe display panel 200A may not match the touch position, however, thedisplay panel 200A may be shown to be bent or pressed at least at thetouch position.

In the state where the first sensor 450 and the second sensor 460 areformed in the same layer, each of the first sensor 450 and the secondsensor 460 shown in FIGS. 4c and 4d may be, as shown in FIG. 9a ,composed of a plurality of lozenge-shaped sensors. Here, the pluralityof the first sensors 450 are connected to each other in the first axialdirection, and the plurality of the second sensors 460 are connected toeach other in the second axial direction orthogonal to the first axialdirection. The lozenge-shaped sensors of at least one of the firstsensor 450 and the second sensor 460 are connected to each other througha bridge, so that the first sensor 450 and the second sensor 460 may beinsulated from each other. Also, here, the first sensor 450 and thesecond sensor 460 shown in FIGS. 5a to 5c may be composed of a sensorhaving a form shown in FIG. 9 b.

In the foregoing, it is shown that the touch pressure is detected fromthe change of the mutual capacitance between the first sensor 450 andthe second sensor 460. However, the pressure sensing unit may beconfigured to include only any one of the first sensor 450 and thesecond sensor 460. In this case, it is possible to detect the magnitudeof the touch pressure by detecting the change of the capacitance betweenthe one pressure sensor and a ground layer (the reference potentiallayer disposed inside the display module 200 or the substrate 300), thatis to say, the change of the self-capacitance. Here, the drive signal isapplied to the one pressure sensor, and the change of theself-capacitance between the pressure sensor and the ground layer can bedetected by the pressure sensor.

For instance, in FIG. 4c , the pressure sensor may be configured toinclude only the first sensor 450. Here, the magnitude of the touchpressure can be detected by the change of the capacitance between thefirst sensor 450 and the substrate 300, which is caused by a distancechange between the substrate 300 and the first sensor 450. Since thedistance “d” is reduced with the increase of the touch pressure, thecapacitance between the substrate 300 and the first sensor 450 may beincreased with the increase of the touch pressure. Here, the pressuresensor should not necessary have a comb teeth shape or a trident shape,which is required to improve the detection accuracy of the mutualcapacitance change amount. The pressure sensor may have a plate shape(e.g., quadrangular plate). Or, as shown in FIG. 9d , the plurality ofthe first sensors 450 may be disposed at a regular interval in the formof a grid.

FIG. 4e shows that the pressure sensors 450 and 460 are formed withinthe spacer layer 420 and on the top surface of the substrate 300 and onthe bottom surface of the display panel 200A. Here, the first sensor 450may be formed on the bottom surface of the display panel 200A, and thesecond sensor 460 may be disposed on the top surface of the substrate300 in the form of a sensor sheet in which the second sensor 460 isformed on a first insulation layer 470 and a second insulation layer 471is formed on the second sensor 460.

When the object 500 applies a pressure to the surface of the cover layer100, the cover layer 100 and the display panel 200A may be bent orpressed. As a result, a distance “d” between the first sensor 450 andthe second sensor 460 may be reduced. In this case, the mutualcapacitance between the first sensor 450 and the second sensor 460 maybe increased with the reduction of the distance “d”. Therefore, themagnitude of the touch pressure can be calculated by obtaining theincrease amount of the mutual capacitance from the sensing signalobtained through the receiving sensor. Here, in FIG. 4e , since thefirst sensor 450 and the second sensor 460 are formed in differentlayers, the first sensor 450 and the second sensor 460 should notnecessary have a comb teeth shape or a trident shape. Any one sensor ofthe first sensor 450 and the second sensor 460 may have a plate shape(e.g., quadrangular plate), and the other remaining plural sensors maybe, as shown in FIG. 9d , disposed at a regular interval in the form ofa grid.

In the touch input device 1000 according to the embodiment of thepresent invention, the pressure sensors 450 and 460 may be directlyformed on the display panel 200A. FIGS. 5a to 5c are cross sectionalviews showing an embodiment of the pressure sensor formed directly onvarious display panel of the touch input device according to theembodiment of the present invention.

First, FIG. 5a shows the pressure sensors 450 and 460 formed on thedisplay panel 200A using the LCD panel. Specifically, as shown in FIG.5a , the pressure sensors 450 and 460 may be formed on the bottomsurface of the second substrate layer 262. Here, the pressure sensors450 and 460 may be formed on the bottom surface of the secondpolarization layer 272. In detecting the touch pressure on the basis ofthe mutual capacitance change amount when a pressure is applied to thetouch input device 1000, a drive signal is applied to the drive sensor,and an electrical signal including information on the capacitance whichis changed by the distance change between the pressure sensors 450 and460 and the reference potential layer (not shown) separated from thepressure sensors 450 and 460 is received from the receiving sensor. Whenthe touch pressure is detected on the basis of the self-capacitancechange amount, a drive signal is applied to the pressure sensors 450 and460, and an electrical signal including information on the capacitancewhich is changed by the distance change between the pressure sensors 450and 460 and the reference potential layer (not shown) separated from thepressure sensors 450 and 460 is received from the pressure sensors 450and 460.

Next, FIG. 5b shows the pressure sensors 450 and 460 formed on thebottom surface of the display panel 200A using the OLED panel (inparticular, AM-OLED panel). Specifically, the pressure sensors 450 and460 may be formed on the bottom surface of the second substrate layer283. Here, a method for detecting the pressure is the same as thatdescribed in FIG. 5 a.

In the case of the OLED panel, since the organic material layer 280emits light, the pressure sensors 450 and 460 which are formed on thebottom surface of the second substrate layer 283 disposed under theorganic material layer 280 may be made of an opaque material. However,in this case, a pattern of the pressure sensors 450 and 460 formed onthe bottom surface of the display panel 200A may be shown to the user.Therefore, for the purpose of directly forming the pressure sensors 450and 460 on the bottom surface of the second substrate layer 283, a lightshielding layer like black ink is disposed on the bottom surface of thesecond substrate layer 283, and then the pressure sensors 450 and 460may be formed on the light shielding layer.

Also, FIG. 5b shows that the pressure sensors 450 and 460 are formed onthe bottom surface of the second substrate layer 283. However, a thirdsubstrate layer may be disposed under the second substrate layer 283,and the pressure sensors 450 and 460 may be formed on the bottom surfaceof the third substrate layer. In particular, when the display panel 200Ais a flexible OLED panel, the third substrate layer 285 which is notrelatively easily bent may be disposed under the second substrate layer283 because the display panel 200A composed of the first substrate layer281, the organic material layer 280, and the second substrate layer 283is very thin and easily bent. Here, the light shielding layer may bedisposed under the third substrate layer 285, and a detailed descriptionthereof will be provided below. In another embodiment of the presentinvention, a substrate having a function of shielding light such as asubstrate colored black may be used as the third substrate layer 285. Assuch, when the third substrate layer has the light shielding function,the pattern of the pressure sensor 450 formed under the display panel200A is not visible to the user even if a separate light shielding layeris not disposed.

Next, FIG. 5c shows the pressure sensor 450 formed inside the displaypanel 200A using the OLED panel. Specifically, the pressure sensor 450may be formed on the top surface of the second substrate layer 283.Here, a method for detecting the pressure is the same as that describedin FIG. 5 a.

Also, although the display panel 200A using the OLED panel has beendescribed by taking an example thereof with reference to FIG. 5c , it ispossible that the pressure sensor 450 is formed on the top surface ofthe second substrate layer 262 of the display panel 200A using the LCDpanel.

Also, although it has been described in FIGS. 5a to 5c that the pressuresensor 450 is formed on the top surfaces or bottom surfaces of thesecond substrate layers 262 and 283, it is possible that the pressuresensor 450 is formed on the top surfaces or bottom surfaces of the firstsubstrate layers 261 and 281.

Next, as described above, when, particularly, the pressure sensor 450 isformed on the bottom surface of the display panel 200A, which is theOLED panel, according to the embodiment of FIG. 5b , the organicmaterial layer 280 emits light. Therefore, when the pressure sensor 450which is formed on the bottom surface of the second substrate layer 283disposed under the organic material layer 280 is made of an opaquematerial, the pattern of the pressure sensor 450 formed on the bottomsurface of the display panel 200A is visible to the user. There is aneed to arrange a separate light shielding layer in order that thepattern of the pressure sensor 450 is not visible.

Hereinafter, FIGS. 6a to 6f show the shape of the display panel 200A dueto the arrangement of the light shielding layer.

According to the embodiment of the present invention, as described inFIG. 6a , after the light shielding layer 284, for example, black ink,is disposed under the second substrate layer 283, the pressure sensor450 may be formed on the bottom surface of the light shielding layer284.

Further, according to another embodiment of the present invention, asdescribed in FIG. 6b , after the pressure sensor 450 is first formed indirect contact with the bottom surface of the second substrate layer283, the light shielding layer 284 may be disposed under the secondsubstrate layer 283 on which the pressure sensor 450 has been formed.

According to another embodiment of the present invention, as describedin FIG. 6c , the third substrate layer 285 may be disposed under thesecond substrate layer 283 of the display panel 200A. Here, after thelight shielding layer 284, for example, black ink, is disposed under thethird substrate layer 285, the pressure sensor 450 may be formed on thebottom surface of the light shielding layer 284.

Also, according to another embodiment of the present invention, asdescribed in FIG. 6d , the third substrate layer 285 may be disposedunder the second substrate layer 283 of the display panel 200A. Here,after the pressure sensor 450 is first formed in direct contact with thebottom surface of the third substrate layer 285, the light shieldinglayer 284 may be disposed under the third substrate layer 285 on whichthe pressure sensor 450 has been formed.

Also, according to another embodiment of the present invention, asdescribed in FIG. 6e , the third substrate layer 285 may be disposedunder the second substrate layer 283 of the display panel 200A. Here,after the pressure sensor 450 is formed in direct contact with thebottom surface of the third substrate layer 285, the light shieldinglayer 284 may be disposed between the second substrate layer 283 and thethird substrate layer 285.

Lastly, according to another embodiment of the present invention, asdescribed in FIG. 6f , the third substrate layer 285 may be disposedunder the second substrate layer 283 of the display panel 200A. Here,the light shielding layer 284 may be disposed under the third substratelayer 285, and the pressure sensor 450 may be disposed between thesecond substrate layer 283 and the third substrate layer 285.

In the above six embodiments, the light shielding layer may include ablack film, a black double adhesive tape (ADT), or a black elasticmaterial which absorbs the impact on the touch input device as well asblack ink. Here, the elastic material (or elastic foam) according to theembodiment has a flexibility that changes the shape thereof, forexample, allows the elastic foam to be pressed when the impact isapplied to the elastic foam, so that the elastic foam may not only serveto absorb the impact but also have the restoring force to provide theperformance uniformity for the pressure detection. For example, theelastic foam may include at least any one of polyurethane, polyester,polypropylene, and acrylic.

The “black” according to the embodiment of the present invention maymean a complete black without light reflection or may mean a blackhaving brightness and saturation, either or both of which are differentfrom those of the complete black within a range of a predeterminedthreshold. For example, in the former case, the black may mean acomplete 100% black, and in the latter case, the black may mean a blackhaving brightness and saturation, either or both of which are differentfrom those of the complete black within a range of a predeterminedthreshold (e.g., a range of 30%). In the latter case, even if the lightshielding layer 284 has only the brightness or saturation of about 70%black, the pressure sensor 450 can be shielded from the light. In otherwords, the range of a predetermined threshold may mean a range capableof shielding the pressure sensor 450 from the light.

Next, as described in FIGS. 6c to 6f , in particular, when the displaypanel 200A according to the embodiment of the present invention is theflexible OLED panel, the third substrate layer 285 which is notrelatively easily bent may be disposed under the second substrate layer283 because the display panel 200A composed of the first substrate layer281, the organic material layer 280, and the second substrate layer 283is very thin and easily bent.

The flexible OLED panel on which the third substrate layer 285 isdisposed and a manufacturing process thereof will be described in detailwith reference to the following FIGS. 7, 8 a, and 8 b.

As shown in FIG. 7, the flexible OLED panel 200A according to theembodiment of the present invention may be composed of the firstsubstrate layer 281, the organic material layer 280, and the secondsubstrate layer 283. The third substrate layer 285 on which the pressuresensor 450 has been formed may be disposed under the second substratelayer 283.

Meanwhile, the respective substrate layers 281, 283, and 285 and theorganic material layer 280 included in the flexible OLED panel 200Ashown in FIG. 7 may be cut by cutting release process. A method formanufacturing the touch input device by the cutting release process willbe described with reference to FIG. 8.

The method for manufacturing the touch input device according to theembodiment of the present invention may include a display forming step(1), a pressure sensor forming step (2), and an adhering step (3).Specifically, the display forming step (1) may include, as shown in FIG.8a , forming the display panel 200A (hereinafter, it is premised thatthe display panel 200A is the flexible display.) for a plurality ofdisplay devices on one carrier substrate, cutting the formed flexibledisplay 200A into individual pieces, and separating the cut flexibledisplay 200A from the carrier substrate. According to the embodiment ofthe present invention, the carrier substrate may be made of carrierglass. Also, the pressure sensor forming step (2) may include forming apressure sensor for the plurality of display devices on the thirdsubstrate layer 285 (hereinafter, it is premised that the thirdsubstrate layer is a substrate for the pressure sensor.) and cutting thesubstrate 285 for the pressure sensor, on which the pressure sensor hasbeen formed, into individual pieces. Lastly, the adhering step (3) mayinclude adhering the flexible display 200A which has been separated intoindividual pieces in the step (1) to the substrate 285 for the pressuresensor, which has been cut into individual pieces in the step (2).

Here, the (1), (2), and (3) do not mean a process sequence. The steps(1) and (2) can be independently performed. That is, after the displayforming step (1) is performed first, the pressure sensor forming step(2) may be performed. Alternatively, after the pressure sensor formingstep (2) is performed, the display forming step (1) may be performed.Alternatively the steps (1) and (2) may be performed at the same time.

Meanwhile, the display forming step (1) shown in FIG. 8a will bedescribed in detail as follows. First, carrier substrate polyimide iscoated on the carrier substrate and cured, and then the second substratelayer 283 can be formed (see (a) to (d)). For example, the secondsubstrate layer 283 can be formed by low temperature polycrystallinesilicon (LTPS) process which forms poly-Si TFT at a low temperature (see(d)). The organic material layer 280 can be formed on the secondsubstrate layer 283. For example, R, G, B luminescent materials arepatterned on each pixel by using fine metal mask (FMM) depositionprocess, and then the organic material layer 280 can be formed (see(e)). After the organic material layer 280 is formed, the firstsubstrate layer 281 is formed on the organic material layer 280 (see(f)). The first substrate layer 281 may be made of encapsulating film.

After the flexible display 200A including the first substrate layer 281,the organic material layer 280, and the second substrate layer 283 whichhave been formed through the above-described process is cut intoindividual pieces (see (g)), the cut flexible display is separated fromthe carrier substrate by irradiating laser. The display forming step (1)is performed accordingly (see (h)).

Meanwhile, the touch input device shown in FIG. 7 may also include theabove-described light shielding layer for shielding the pressure sensorfrom the light.

For example, after the process including the above-described displayforming step (1), the pressure sensor forming step (2), and the adheringstep (3) is performed, the light shielding layer 284 for shielding thepressure sensor 450 from the light may be disposed under the thirdsubstrate layer 285 on which the pressure sensor 450 has been formed.This light shielding layer 284 may have the same properties as thosedescribed in FIG. 6 d.

Meanwhile, the pressure sensor 450 which is used in the touch inputdevice according to the embodiment of the present invention and iscapable of sensing the touch pressure may include a pressure electrodeor a strain gauge. Also, the display module is bent according to thetouch pressure on the touch input device, and the touch pressure can bedetected based on the electrical characteristics of the pressure sensor450 due to the bending.

When the pressure sensor 450 is the pressure electrode, the touch inputdevice may include the reference potential layer (e.g., the substrate300) formed at a predetermined distance apart from the pressureelectrode and is able to detect the touch pressure on the basis of thecapacitance that is changed according to the distance between thepressure electrode and the reference potential layer. In the meantime,when the pressure sensor 450 is the strain gauge shown in FIG. 10, thetouch pressure can be detected based on the change of the resistancevalue of the strain gauge due to the touch pressure.

Meanwhile, as shown in FIG. 8b , the touch input device can bemanufactured by another embodiment of the present invention.

The processes (a) to (f) are the same as that described in FIG. 8a . Bythe processes (a) to (f), the flexible display 200A for the plurality ofdisplay devices can be formed on one sheet of a carrier substrate (see(f)). Then, the flexible display 200A can be separated from the carriersubstrate by irradiating laser (see (g)). Also, separately from this,the pressure sensor 450 for the plurality of display devices can beformed on one substrate for the pressure sensor (third substrate layer285 (see (h)). After the flexible display 200A separated by the process(g) is adhered to the substrate 285 for the pressure sensor on which thepressure sensor 450 has been formed by the process (h) (see (i)), thesubstrate 285 for the pressure sensor and the flexible display 200Awhich have been adhered to each other are cut into individual pieces(see (j)), so that the touch input device shown in FIG. 7 can be finallymanufactured.

Although the embodiment of FIG. 8b has described the step (1) ofseparating the manufactured flexible display 200A and the step (2) offorming the pressure sensor 450 on the substrate 285 for the pressuresensor, this does not mean a process sequence. That is, after the step(1) is performed first, the step (2) may be performed. Alternatively,after the step (2) is performed, the step (1) may be performed.Alternatively the steps (1) and (2) may be performed at the same time.

Meanwhile, the touch input device shown in FIG. 7 may also include theabove-described light shielding layer for shielding the pressure sensorfrom the light.

For example, in the touch input device manufactured by the processes (a)to (j) described in FIG. 8b , the light shielding layer 284 forshielding the pressure sensor 450 from the light may be disposed underthe third substrate layer 285 on which the pressure sensor 450 has beenformed. This light shielding layer 284 may have the same properties asthose described in FIG. 6 d.

Meanwhile, various methods for forming the pressure sensor 450 on thethird substrate layer 285 will be described below.

For reference, below-described various methods for forming the pressuresensor 450 on the third substrate layer 285 can be also applied in thesame manner as or a similar manner to a case where the pressure sensor450 is formed on the second substrate layer 283.

The method for forming the pressure sensor 450 on the third substratelayer 285 includes Gravure printing method (or roller printing method).

The Gravure printing method includes a Gravure offset printing methodand a Reverse offset printing method. The Gravure offset printing methodincludes a roll type printing method and a sheet type printing method.Hereafter, the roll type printing method and the sheet type printingmethod which are included in the Gravure offset printing method, and theReverse offset printing method will be described in turn with referenceto the drawings.

FIG. 11 is a view for describing a method for forming the pressuresensor 450 on the third substrate layer 285 by using a roll-typeprinting method.

Referring to FIG. 11, a pressure sensor constituent material is injectedinto a groove 815 formed in a Gravure roll 810 by using an injectionunit 820. Here, the pressure sensor constituent material is filled inthe groove 815 by using a blade 830. Here, the shape of the groove 815corresponds to the shape of the pressure sensor 450 to be printed on thebottom surface of the inverted third substrate layer 285. The blade 830functions to remove the excess amount of the pressure sensor constituentmaterial overflowing the groove 815 and to push the pressure sensorconstituent material into the groove 815. The injection unit 820 and theblade 830 are fixed and mounted around the Gravure roll 810. The Gravureroll 810 rotates counterclockwise.

The pressure sensor pattern M filled in the groove 815 of the Gravureroll 810 is transferred to a blanket 855 of a transfer roll 850 byrotating the Gravure roll 810. The rotation direction of the transferroll 850 is opposite to the rotation direction of the Gravure roll 810.The blanket 855 may be made of a resin having a predetermined viscosity,particularly, silicon-based resin.

The transfer roll 850 is rotated and the pressure sensor pattern Mtransferred to the blanket 855 of the transfer roll 850 is transferredto the third substrate layer 285. As a result, the pressure sensor 450may be formed on the bottom surface of the inverted third substratelayer 285.

The roll type printing method shown in FIG. 11 has a better productivitythan those of the methods shown in FIGS. 12 and 13, and thus, isadvantageous for forming the pressure sensor having a simple shape suchas a stripe-shaped pressure sensor or a mesh-shaped pressure sensor.

FIG. 12 is a view for describing a method for forming the pressuresensor 450 on the third substrate layer 285 by using the sheet typeprinting method.

Referring to FIG. 12, the pressure sensor constituent material isinjected into a groove 915 of a Cliche plate 910, and the pressuresensor pattern M is formed in the groove 915.

A transfer roll 950 including a blanket 955 is rotated on the Clicheplate 910, and the pressure sensor pattern M is transferred to theblanket 955. Here, the transfer roll 950 is only rotated in a fixedstate and the Cliche plate 910 can move under the transfer roll 950.Alternatively, the Cliche plate 910 is fixed and the transfer roll 950can move with the rotation on the Cliche plate 910. The shape of thegroove 915 corresponds to the shape of the pressure sensor 450 to beprinted on the bottom surface of the inverted third substrate layer 285.The blanket 955 may be made of a resin having a predetermined viscosity,particularly, silicon-based resin.

When the pressure sensor pattern M is transferred to the blanket 955 ofthe transfer roll 950, the transfer roll 950 is rotated on the thirdsubstrate layer 285 and the pressure sensor pattern M is transferred tothe bottom surface of the third substrate layer 285. As a result, thepressure sensor 450 can be formed on the bottom surface of the invertedthird substrate layer 285. Here, the transfer roll 950 is only rotatedin a fixed state and the third substrate layer 285 can move under thetransfer roll 950. Alternatively, the third substrate layer 285 is fixedand the transfer roll 950 can move with the rotation on the thirdsubstrate layer 285.

FIG. 13 is a view for describing a method for forming the pressuresensor 450 on the third substrate layer 285 by using the reverse offsetprinting method.

Referring to FIG. 13, a transfer roll 1050 including a blanket 1055 isrotated on a Cliche plate 1010 including a protrusion 1015, and thepressure sensor pattern M is processed from a pressure sensorconstituent material layer L coated on the entire outer surface of theblanket 1055. A portion of the pressure sensor constituent materiallayer L coated on the entire outer surface of the blanket 1055, whichcontacts the protrusion 1015, is transferred to the protrusion 1015 andthe other portions, which do not contact the protrusion 1015, remain inthe blanket 1055 as they are. Therefore, a predetermined pressure sensorpattern M of which the portions has been removed by the protrusion 1015may be formed on the blanket 1055. Here, the transfer roll 1050 is onlyrotated in a fixed state and the Cliche plate 1010 can move under thetransfer roll 1050. Alternatively, the Cliche plate 1010 is fixed andthe transfer roll 1050 can move with the rotation on the Cliche plate1010. The shape of the protrusion 1015 corresponds to the shape of thepressure sensor 450 to be printed on the bottom surface of the invertedthird substrate layer 285. The blanket 1055 may be made of a resinhaving a predetermined viscosity, particularly, silicon-based resin.

When the pressure sensor pattern M is processed on the blanket 1055 ofthe transfer roll 1050, the transfer roll 1050 is rotated on the thirdsubstrate layer 285, and the pressure sensor pattern M is transferred tothe bottom surface of the third substrate layer 285. As a result, thepressure sensor 450 can be formed on the bottom surface of the invertedthird substrate layer 285. Here, the transfer roll 1050 is only rotatedin a fixed state and the third substrate layer 285 can move under thetransfer roll 1050. Alternatively, the third substrate layer 285 isfixed and the transfer roll 1050 can move with the rotation on the thirdsubstrate layer 285.

The reverse offset printing method is advantageous for forming the largearea pressure sensor.

Through use of the Gravure printing method shown in FIGS. 11 to 13, thepressure sensor 450 can be directly printed and formed on the thirdsubstrate layer 285. Although the Gravure printing method has a somewhatlower resolution than the resolution of the above-describedphotolithography, etching resist method, and etching paste method, thepressure sensor formation process in the Gravure printing method issimpler than those of the above-described methods, and the Gravureprinting method has a better productivity.

Also, the pressure sensor 450 may be formed on the third substrate layer285 by the inkjet printing method.

The inkjet printing method means that a droplet (diameter less than 30μm), i.e., the constituent material of the pressure sensor 450 isdischarged and then the pressure sensor 450 is patterned on the thirdsubstrate layer 285.

The inkjet printing method is suitable for implementing a complicatedshape in a small volume in a non-contact manner. The inkjet printingmethod has a simple process, a reduced facility cost, and a reducedmanufacturing cost. The inkjet printing method has a low environmentalload and does not waste raw material because the material is accumulatedat a desired pattern position and thus there is no material loss inprinciple. Also, like photolithography, the inkjet printing method doesnot require a process such as development and etching, etc., so that thecharacteristics of the substrate or material are not degraded bychemical effects. Also, since the inkjet printing method is performed ina non-contact manner, devices are not damaged by contact. A substratehaving unevenness can be also patterned. When the printing is performedin an on-demand manner, the pattern shape can be directly edited andchanged by a computer.

The inkjet printing method is divided into a continuous manner in whichthe droplet is continuously discharged and an on-demand manner in whichthe droplet is selectively discharged. The continuous manner is mainlyused in low resolution marking because the continuous manner generallyrequires large devices and has low print quality, so that the continuousmanner is not suitable for colorization. The on-demand manner is usedfor high resolution patterning.

The on-demand inkjet printing method includes a piezo method and abubble jet method (thermal method). In the piezo method, the volume ischanged by replacing an ink chamber with a piezoelectric element (whichis deformed when a voltage is applied), and when a pressure is appliedto the ink within the ink chamber, the ink is discharged through anozzle. In the bubble jet method, bubbles are instantaneously generatedby applying heat to the ink, and then the ink is discharged by thepressure. The bubble jet method is the most suitable for an officebecause it is easy to miniaturize and densify the device and the cost ofthe head is low. However, the head has a short durability life due tothe heat application and the available ink is limited because the effectof the boiling point of solvent or heat damage to the ink material isinevitable. In comparison with this, in the piezo method, thedensification and head cost are worse than those of the bubble jetmethod. However, the piezo method has an excellent durability life ofthe head and excellent flexibility of the ink because no heat is appliedto the ink. Therefore, the piezo method is more suitable for commercialprinting, industrial printing, and device manufacture as well asoffices.

FIG. 14 is a view for describing a method for forming the pressuresensor 450 on the third substrate layer 285 by using the inkjet printingmethod.

Referring to FIG. 14, a fine droplet 1150 discharged through a nozzle1110 flows in the air and is attached to the surface of the thirdsubstrate layer 285, and the solvent is dried and a solid component isfixed, so that the pressure sensor 450 is formed.

The size of the droplet 1150 is several to scores of pl and the diameterof the droplet 1150 is about 10 μm. The droplet 1150 collides with andis attached to one side of the third substrate layer 285 and then formsa predetermined pattern. The key factor for determining the resolutionof the formed pattern is the size and wettability of the droplet 1150.The droplet 1150 dropped onto the third substrate layer 285 spreads onthe third substrate layer 285 in a two dimensional way and finallybecomes the pressure sensor 450 having a size larger than that of thedroplet 1150. The spread of the droplet 1150 depends on the kineticenergy at the time of colliding with the third substrate layer 285 andon the wettability of the solvent. In the case of very fine droplet1150, the kinetic energy has a very small effect and the wettability hasa dominant effect. When the droplet 1150 has a lower wettability and agreater wetting angle, the spread of the droplet 1150 is restricted, sothat the fine pressure sensor 450 can be printed. However, if thewetting angle is too large, the droplets 1150 bounce and gather, so thatthe pressure sensor 450 may not be formed. Therefore, in order to obtainthe high resolution pressure sensor 450, it is necessary to control thesolvent selection or the surface condition of the third substrate layer285 so as to obtain an appropriate wetting angle. It is desirable thatthe wetting angle should be approximately 30 to 70 degrees. The solventof the droplet 1150 attached to the third substrate layer 285 isevaporated and the pressure sensor 450 is fixed. In this step, thedrying rate is high because the size of the droplet 1150 is very small.

In addition, the method for forming the pressure sensor 450 on the thirdsubstrate layer 285 includes a screen printing method.

FIG. 15 is a view for describing a method for forming the pressuresensor 450 on the third substrate layer 285 by using the screen printingmethod.

As with the inkjet printing method, the screen printing method has a lowmaterial loss.

Referring to FIG. 15, a paste 1230, i.e., the pressure sensorconstituent material, is placed on a screen 1210 pulled with a strongtension and a squeegee 1250 is moved while being pressed down. Then, thepaste 1230 is pushed and transferred to the surface of the thirdsubstrate layer 285 through a mesh of the screen 1210.

In FIG. 15, a reference numeral 1215 represents a screen frame. Areference numeral 1270 represents plastic emulsion. A reference numeral1280 represents Nest which is mounted on the third substrate layer 285.A reference numeral 1290 represents a flood blade.

The mesh of the screen 1210 may be made of stainless metal for thepurpose of the fine pressure sensor 450. Since the paste 1230 needs anappropriate viscosity, the paste 1230 may be obtained by dispersing aresin or solvent in a basic material such as metal powder orsemiconductor, etc. According to the screen printing method, while aninterval of several millimeters is maintained between the screen 1210and the third substrate layer 285, at the moment when the squeegee 1250passes through the interval, the screen 1210 comes in contact with thethird substrate layer 285 and the paste 1230 is transferred. Though thescreen printing method is a contact type printing method, there islittle effect of the third substrate layer 285 through the contact.

The screen printing method is performed through four basic processessuch as rolling, discharging, plate separation, and leveling. Therolling means that the paste 1230 is rotated forward on the screen 1210by the moving squeegee 1250. The rolling functions to stabilize theviscosity of the paste 1230 constantly and is an important process forobtaining a uniform thin film. The discharging means that the paste 1230is pushed by the squeegee 1250, passes through between the screen 1210and the mesh, and is pushed to the surface of the third substrate layer285. The discharge force depends on the moving speed of the squeegee1250 and an angle formed by the squeegee 1250 with the screen 1210. Theless the angle of the squeegee 1250 is and the less the moving speed is,the greater the discharge force is. The plate separation means that thescreen 1210 is separated from the third substrate layer 285 after thepaste 1230 reaches the surface of the third substrate layer 285. Theplate separation is a very important process for determining theresolution and continuous printability. The paste 1230 which has passedthrough the screen 1210 and has reached the third substrate layer 285 isspread with the fixing to the screen 1210 and the third substrate layer285. Therefore, it is preferable that the paste 1230 should beimmediately separated from the screen 1210. For this purpose, the screen1210 needs to be pulled with a high tension. The paste 1230 which hasbeen discharged on the third substrate layer 285 and has beenplate-separated has fluidity. Therefore, the pressure sensor 450 islikely to change, so that a mark or pin hole, etc., is generated in themesh. As time goes by, the viscosity is increased due to the evaporationof the solvent, etc., and the fluidity is lost. Eventually, the pressuresensor 450 is completed. This process is referred to as the leveling.

The printing condition of the pressure sensor 450 by the screen printingmethod depends on the following four factors. {circle around (1)}clearance for stable plate separation {circle around (2)} the angle ofthe squeegee 1250 for discharging the paste 1230 {circle around (3)} thespeed of the squeegee 1250, which affects the discharge of the paste1230 and the plate separation speed, and {circle around (4)} thepressure of the squeegee 1250 which scrapes the paste 1230 on the screen1210.

The thickness of the pressure sensor 450 which is printed is determinedby a discharge amount obtained through multiplication of the meshthickness of the screen 1210 and an opening ratio. The accuracy of thepressure sensor 450 depends on the fineness of the mesh. For the purposeof rapid plate separation, the screen 1210 needs to be pulled with astrong tension. However, when a fine patterning is performed by usingthe screen 1210 having a thin mesh, the tension may exceed the limit ofa dimension stability that the screen 1210 having a thin mesh canendure. However, by using the screen 1210 to which a wire of about 16 μmis applied, the pressure sensor 450 having a line width of less than 20μm can be patterned.

In addition, the method for forming the pressure sensor 450 on the thirdsubstrate layer 285 includes a flexographic printing method.

FIG. 16 is a view for describing a method for forming the pressuresensor 450 on the third substrate layer 285 by using the flexographicprinting method.

Referring to FIG. 16, the ink, i.e., the pressure sensor constituentmaterial which is supplied from a supplier 1310 is applied on an Aniloxroller 1320 having a uniform grating, and is uniformly spread on thesurface of the Anilox roller 1320 by using a doctor blade (not shown).Next, the ink spread on the surface of the Anilox roller 1320 istransferred in an embossed pattern to a soft printing substrate 1340mounted on a printing cylinder 1330. Then, the ink transferred to thesoft printing substrate 1340 is printed on the surface of the thirdsubstrate layer 285 which moves by the rotation of a hard printing roll1350. As a result, the pressure sensor 450 is formed.

Regarding the flexographic printing method shown in FIG. 16, thethickness of the pressure sensor 450 which is printed on the thirdsubstrate layer 285 can be controlled by a pore size and density of theAnilox roller 1320, so that it is possible to form a uniform thin film.Also, the location or range in which the ink is applied can be preciselyadjusted by changing the shape of the patterned pressure sensor 450.Therefore, the flexographic printing method can be also applied toprinting using a flexible substrate.

The flexographic printing method is used to apply an alignment film ofthe LCD. A polyimide alignment film having a uniform thickness is formedby the flexographic printing method and a rubbing method is used.Meanwhile, as the size of the third substrate layer 285 is increased,the third substrate layer 285 after the six generation (1500×1800) mayhave a form in which the printing roll 1350 moves.

Further, the method for forming the pressure sensor 450 on the thirdsubstrate layer 285 includes a transfer printing method. The transferprinting method includes a laser transfer printing method and a thermaltransfer printing method.

FIG. 17 is a view for describing a method for forming the pressuresensor 450 on the third substrate layer 285 by using the laser transferprinting method.

Referring to FIG. 17, the ink, i.e., the pressure sensor constituentmaterial stored in a supplier 1410 is supplied to an ink station 1440 bya pump 1430. Here, the supplier 1410 may include a controller 1420 forcontrolling the viscosity and temperature of the ink.

The ink present in the ink station 1440 is coated on one side of atransparent endless belt 1460 by a roller 1450. Here, the transparentendless belt 1460 is rotated by a plurality of guide rollers 1470.

While the transparent endless belt 1460 is rotated by the guide roller1470, laser 1480 is applied to the transparent endless belt 1460, sothat the ink is transferred from the transparent endless belt 1460 tothe surface of the third substrate layer 285. Through the control of thelaser, predetermined ink is transferred to the third substrate layer 285by heat generated by the laser and the pressure of the laser. Thetransferred ink becomes the pressure sensor 450. Here, the thirdsubstrate layer 285 is delivered in a predetermined print direction by ahandling system 1490. Meanwhile, though not shown, the thermal transferprinting method is similar to the laser transfer printing method shownin FIG. 17. The thermal transfer printing method is that a heatradiating device that radiates high temperature heat is added to thetransparent endless belt coated with the ink, and the pressure sensor450 having a predetermined pattern is formed on the surface of the thirdsubstrate layer 285.

Through the transfer printing method including the laser transferprinting method and the thermal transfer printing method, there is anadvantage in that it is possible to very precisely form the pressuresensor 450 transferred to the third substrate layer 285 such that thepressure sensor 450 has an accuracy of about ±2.5 μm.

The features, structures and effects and the like described in theembodiments are included in one embodiment of the present invention andare not necessarily limited to one embodiment. Furthermore, thefeatures, structures, effects and the like provided in each embodimentcan be combined or modified in other embodiments by those skilled in theart to which the embodiments belong. Therefore, contents related to thecombination and modification should be construed to be included in thescope of the present invention.

Although embodiments of the present invention were described above,these are just examples and do not limit the present invention. Further,the present invention may be changed and modified in various ways,without departing from the essential features of the present invention,by those skilled in the art. For example, the components described indetail in the embodiments of the present invention may be modified.Further, differences due to the modification and application should beconstrued as being included in the scope and spirit of the presentinvention, which is described in the accompanying claims.

What is claimed is:
 1. A method for manufacturing touch input devices,the method comprising: a display forming step of forming, on a singlecarrier substrate, a flexible display for each of a plurality of displaydevices, cutting the flexible display into individual pieces, andseparating the flexible display from the carrier substrate; a separatestructure different from electrodes used to detect touch positionforming step of forming, under a single substrate, a separate structuredifferent from electrodes used to detect touch position for each of theplurality of display devices and cutting the substrate for the separatestructure into individual pieces; and an adhering step of adhering eachof the individual pieces of the separated flexible display to anindividual piece of the substrate for the separate structure; whereinthe substrate for the separate structure is not relatively easily bentas compared to the flexible display.
 2. The method of claim 1, whereinthe display forming step comprises: forming a second substrate layer onthe carrier substrate; forming an organic material layer on the secondsubstrate layer; forming a first substrate layer on the organic materiallayer; cutting the flexible display comprising the first substratelayer, the organic material layer, and the second substrate layer intoindividual pieces; and separating the cut flexible display from thecarrier substrate by irradiating laser.
 3. The method of claim 1,wherein the separate structure comprises a pressure electrode capable ofdetecting a touch pressure on the basis of a capacitance change amountaccording to the touch pressure on the touch input device.
 4. The methodof claim 1, wherein the separate structure comprises a strain gaugecapable of detecting a touch pressure on the basis of a change of aresistance value due to the touch pressure on the touch input device. 5.The method of claim 1, further comprising disposing a light shieldinglayer for shielding the separate structure from light.
 6. The method ofclaim 1, wherein a light shielding layer for shielding the separatestructure from light is formed under the single substrate and adjacentthe separate structure.
 7. The method of claim 1, wherein a lightshielding layer for shielding the separate structure from light isformed under the single substrate and between the separate structure andthe single substrate.
 8. The method of claim 1, wherein a lightshielding layer for shielding the separate structure from light isformed under the single substrate and not adjacent the single substrate.9. A touch input device comprising: a cut flexible display which is cutinto individual pieces for a plurality of display devices and isseparated from a carrier substrate; a cut substrate for a separatestructure different from electrodes used to detect touch position, whichis cut into individual pieces for the plurality of display devices andhas the separate structure formed thereon; and an adhesive which adheresthe separated cut flexible display to the substrate for the separatestructure, which is cut into individual pieces; wherein the cutsubstrate for the separate structure is not relatively easily bent ascompared to the flexible display.
 10. The touch input device of claim 9,wherein the cut flexible display is formed by forming a second substratelayer on the carrier substrate; forming an organic material layer on thesecond substrate layer; forming a first substrate layer on the organicmaterial layer; cutting the flexible display comprising the firstsubstrate layer, the organic material layer, and the second substratelayer into individual pieces; and separating the cut flexible displayfrom the carrier substrate by irradiating laser.
 11. The touch inputdevice of claim 9, wherein the separate structure comprises a pressureelectrode capable of detecting a touch pressure on the basis of acapacitance change amount according to the touch pressure on the touchinput device.
 12. The touch input device of claim 9, wherein theseparate structure comprises a strain gauge capable of detecting a touchpressure on the basis of a change of a resistance value due to the touchpressure on the touch input device.
 13. The touch input device of claim9, further comprising a light shielding layer for shielding the separatestructure from light.
 14. A method for manufacturing a touch inputdevice, the method comprising: a step of forming, on a single carriersubstrate, a flexible display for each of a plurality of displaydevices; a step of separating the flexible display from the carriersubstrate; a step of forming, under a single substrate, a separatestructure different from electrodes used to detect touch position foreach of the plurality of display devices; a step of adhering theseparated flexible display to the substrate for the separate structure;and a step of cutting the substrate for the separate structure and theflexible display which have been adhered to each other into individualpieces; wherein the substrate for the separate structure is notrelatively easily bent as compared to the flexible display.
 15. Themethod of claim 14, wherein the separate structure comprises a pressureelectrode capable of detecting a touch pressure on the basis of acapacitance change amount according to the touch pressure on the touchinput device.
 16. The method of claim 14, wherein the separate structurecomprises a strain gauge capable of detecting a touch pressure on thebasis of a change of a resistance value due to the touch pressure on thetouch input device.
 17. The method of claim 14, further comprisingdisposing a light shielding layer for shielding the separate structurefrom light.
 18. The method of claim 14, wherein a light shielding layerfor shielding the separate structure from light is formed under thesingle substrate and adjacent the separate structure.